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DISCRETE SEMICONDUCTORS
DATA SHEET
handbook, halfpage
M3D167
BGY925/5 UHF amplifier module
Product specification Supersedes data of 2000 Jan 10 2000 Jan 17
Philips Semiconductors
Product specification
UHF amplifier module
FEATURES * 26 V nominal supply voltage * 23 W output power into a load of 50 with an RF drive power of 36 mW. APPLICATIONS * Base station transmitting equipment operating in the 920 to 960 MHz frequency range. DESCRIPTION The BGY925/5 is a three-stage UHF amplifier module in a SOT365A package. The module consists of one NPN silicon planar transistor die and two silicon MOSFET dies mounted together with matching and bias circuitry on a metallized ceramic AlN substrate.
handbook, halfpage
BGY925/5
PINNING - SOT365A PIN 1 2 3 4 Flange RF input VS1 VS2 RF output ground DESCRIPTION
1
2
3
4
MSA447
Fig.1 Simplified outline.
QUICK REFERENCE DATA RF performance at Tmb = 25 C, 100 % tested during manufacture. MODE OF OPERATION CW Note 1. At PL = 16 W. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VS1 VS2 PD PL Tstg Tmb DC supply voltage DC supply voltage input drive power load power storage temperature operating mounting-base temperature PARAMETER - - - - -30 -10 MIN. 5.5 28 80 32 +100 +90 MAX. V V mW W C C UNIT f (MHz) 920 to 960 VS1 (V) 5 VS2 (V) 26 PL (W) 23 Gp (dB) 28 (%) (note 1) 30 ZS, ZL () 50
2000 Jan 17
2
Philips Semiconductors
Product specification
UHF amplifier module
CHARACTERISTICS ZS = ZL = 50 ; PL = 23 W; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C; unless otherwise specified. SYMBOL f IS1 IS2 PL Gp H2 H3 VSWRin PARAMETER frequency range supply current supply current load power power gain efficiency second harmonic third harmonic input VSWR stability reverse intermodulation direct intermodulation NF B noise figure AM bandwidth ruggedness corner frequency = 3 dB; Pcarrier = 16 W; modulation = 20% VSWR 5 : 1 through all phases; VS2 = 26 V; PL = 23 W VSWR 3 : 1 through all phases; VS2 = 26 to 27 V; PL = 23 W Pcarrier = 16 W; Pinterference = 1.6 W; fi = fc 600 kHz Pcarrier = 16 W; Pinterference = 1.6 mW; fi = fc + 270 kHz 160 mW PL 23 W 2 W PL 23 W PL = 16 W PL = 16 W PL = 16 W PD < -60 dBm CONDITIONS - - 23 28 28 30 - - - - - - - 2 MIN. 920 - 50 500 - 30 30 - - - - - -80 -55 - - TYP.
BGY925/5
MAX. 960 - - - 34 32 - -35 -40 2:1 -60 - - 8 -
UNIT MHz mA mA W dB dB % dBc dBc dBc dBc dBc dBc MHz
no degradation
2000 Jan 17
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY925/5
handbook, halfpage
35
MCD830
handbook, halfpage
60
MCD831
Gp (dB) 30 920 MHz
(%) 40
920 MHz 940 MHz
960 MHz 940 MHz 960 MHz
25
20
20 0 10 20 PL (W) 30
0 0 10 20 PL (W) 30
ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C.
ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C.
Fig.2
Power gain as a function of load power; typical values.
Fig.3
Efficiency as a function of load power; typical values.
handbook, halfpage
35
MCD832
handbook, halfpage
3
MCD833
Gp (dB) 30
940 MHz
960 MHz
IS2 (A) 2
920 MHz
25
1
20 10-4
10-2
1
PL (W)
102
0 10-4
10-2
1
102 PL (W)
ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C.
ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C; f = 920 to 960 MHz.
Fig.4
Power gain as a function of load power; typical values.
Fig.5
Supply current as a function of load power; typical values.
2000 Jan 17
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY925/5
handbook, halfpage
35
MCD834
handbook, halfpage
Gp (dB) 30
0 Return Losses (dB) -4
MCD835
-8
-12 25 -16
20 800
900
1000
f (MHz)
1100
-20 800
900
1000
f (MHz)
1100
ZS = ZL = 50 ; PD = -30 dBm; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C.
ZS = ZL = 50 ; PD = -30 dBm; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C.
Fig.6
Small signal in band power gain as a function of frequency; typical values.
Fig.7
Small signal in band input return losses as a function of frequency; typical values.
handbook, halfpage G
40 p (dB) 20
MCD836
handbook, halfpage
34
MCD837
Gp (dB) 32
0 30 -20 28 -40
(7) (6) (4) (5) (2) (3)
(1)
-60
26
-80
24 0 500 1000 f (MHz) 1500 0 10 20 30 PL (W) 40
ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; Tmb = 25 C. (1) Tamb = -33C. (2) Tamb = -20C. ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; PD = -30 dBm; Tmb = 25 C. (3) Tamb = 3C. (4) Tamb = 25C. (5) Tamb = 50C. (6) Tamb = 75C. (7) Tamb = 100C.
Fig.8
Small signal out band power gain as a function frequency; typical values.
Fig.9
Power gain as a function of load power; typical values
2000 Jan 17
5
Philips Semiconductors
Product specification
UHF amplifier module
BGY925/5
handbook, halfpage
50
MCD838
handbook, halfpage
0.5
MCD839
IS2 (A) 0.4
(%) 40
30
0.3
20
0.2
10
0.1
0 -50
0
50
Tamb (C)
100
0 -50
0
50
Tamb (C)
100
ZS = ZL = 50 ; PL = 16 W; VS1 = 5 V; VS2 = 26 V.
ZS = ZL = 50 ; VS1 = 5 V; VS2 = 26 V; PD = 0.
Fig.10 Efficiency as a function of ambient temperature; typical values.
Fig.11 Quiescent current as a function of ambient temperature; typical values.
handbook, halfpage
40
MCD840
handbook, halfpage
34
MCD841
PL(-1db) (W) 30
Gp (dB) 32
30 20 28 10 26
0 -50
0
50
Tamb (C)
100
24 -50
0
50
Tamb (C)
100
ZS = ZL = 50 ; Pref = 5 W; VS1 = 5 V; VS2 = 26 V.
ZS = ZL = 50 ; PL = 5 W; VS1 = 5 V; VS2 = 26 V.
Fig.12 Load power at -1 dB gain as a function of ambient temperature; typical values.
Fig.13 Power gain as a function of ambient temperature; typical values.
2000 Jan 17
6
Philips Semiconductors
Product specification
UHF amplifier module
BGY925/5
handbook, halfpage
pin numbers
1
C3
2
C4
3
4
Z1 R1
L1
R2
L2
Z2
RF input
C1 Vs1
C2 Vs2 RF output
MGL161
Fig.14 Test circuit.
90
1
4
C3
C4
L1 R1 C1
handbook, full pagewidth
L2 R2 C2 2 3
MGL162
Dimensions in mm.
Fig.15 Printed-circuit board component layout.
2000 Jan 17
7
Philips Semiconductors
Product specification
UHF amplifier module
List of components (See Figs 14 and 15) COMPONENT C1, C2 C3, C4 L1, L2 R1, R2 Z1, Z2 Note DESCRIPTION electrolytic capacitor multilayer ceramic chip capacitor Grade 4S2 Ferroxcube bead metal film resistor stripline; note 1 10 ; 0.4 W 50 VALUE 10 F; 35 V 100 nF; 50 V
BGY925/5
CATALOGUE NO.
4330 030 36300 2322 195 13109
1. The striplines are on a double copper-clad printed-circuit board with epoxy dielectric (r = 4.5); thickness = 1 mm. MOUNTING RECOMMENDATIONS To ensure a good thermal contact and to prevent mechanical stress when bolted down, the flatness of the mounting base is designed to be typically better than 0.1 mm. The mounting area of the heatsink should be flat and free from burrs and loose particles. The heatsink should be rigid and not prone to bowing under thermal cycling conditions. The thickness of a solid heatsink should be not less than 5 mm to ensure a rigid assembly. A thin, even layer of thermal compound should be applied between the mounting base and the heatsink to achieve the best possible thermal contact resistance. Excessive use of thermal compound will result in an increase in thermal resistance and possible bowing of the mounting-base; too little will also result in poor thermal conduction. The module should be mounted to the heatsink using 3 mm bolts with flat washers. The bolts should first be tightened to "finger tight" and then further tightened in alternating steps to a maximum torque of 0.4 to 0.6 Nm. Once mounted on the heatsink, the module leads can be soldered to the printed-circuit board. A soldering iron may be used up to a temperature of 250 C for a maximum of 10 seconds at a distance of 2 mm from the plastic cap. ESD precautions must be taken to protect the device from electrostatic damage.
2000 Jan 17
8
Philips Semiconductors
Product specification
UHF amplifier module
PACKAGE OUTLINE
BGY925/5
Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads
SOT365A
D
A F y
U q A
U2 E p U1
L
1
2
bp
3
4
wM vA Q c
e
e1
e
Z
0
10 scale
20 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 9.5 9.0 bp 0.56 0.46 c 0.3 0.2 D 30.1 29.9 E 18.6 18.4 e e1 F 3.25 3.15 L 6.5 6.1 p 4.1 3.9 Q 4.0 3.8 q U U1 15.4 15.2 U2 7.75 7.55 v 0.3 w 0.25 y 0.1 Z 12.8 12.6
2.54 17.78
40.74 48.0 40.54 48.4
OUTLINE VERSION SOT365A
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 99-02-06
2000 Jan 17
9
Philips Semiconductors
Product specification
UHF amplifier module
DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values
BGY925/5
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2000 Jan 17
10
Philips Semiconductors
Product specification
UHF amplifier module
NOTES
BGY925/5
2000 Jan 17
11
Philips Semiconductors - a worldwide company
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 69
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125002/03/pp12
Date of release: 2000
Jan 17
Document order number:
9397 750 06748

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